SMT Process Capability

SMT OEM Process Capability

1. SMT Lead-free Process.
2. Mount capacity up to 1,200,000pcs of chip resistors or capacitors daily.
3. Thru hole capacity up to 50,000pcs of components daily
4. Mountable minimum chip resistor or capacitor is 0201 (Metric) / 0402 (Metric).
5. The finest applicable IC pitch is 0.3 m/m
6. The smallest applicable ball diameter and pitch of BGA are 0.3mm and 0.45mm respectively.
7. Maximum applicable PCB size is L510mm x W4600mm. No minimum size limitation.

Machine

1. Lead-free voluntarily wave soldering machine:1 set, Capacity:70K/day.
2. Lead-free line productivity:1 set, Capacity:70K/day.
3. Automatic SMT line productivity:5 set, Capacity:165000/hr(0402 (Metric))
4.COF line productivity:3 set, Capacity:24Kpcs/day.